Transcend MTE662T2 256 GB Solid State Drive – M.2 2280 Internal – PCI Express NVMe (PCI Express NVMe 3.0 x4) – Desktop PC Device Supported – 2 DWPD – 3 Year Warranty M-KEY 3D TLC BICS4 PE 3K 8CH 30U

VPN: TS256GMTE662T2 UPC: 760557854326 SKU: 01TN13

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$91.99
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256GB M.2 2280 PCIE GEN3X4 M-KEY 3D TLC BICS4 PE 3K 8CH 30U

SKU: a4643604d1a4 Categories: , , Brand:
Drive Performance
Endurance (DWPD)2
Network & Communication
Wireless LANNo
Technical Information
Storage Capacity256 GB
Interfaces/Ports
Drive InterfacePCI Express NVMe
Drive Interface StandardPCI Express NVMe 3.0 x4
Physical Characteristics
Weight (Approximate)0.32 oz
Drive TypeInternal
Form FactorM.2 2280
Length3.1″
Height0.1″
Width0.9″
Miscellaneous
Compatibility
    • Intel Mini PC BKNUC9VXQNX
    • Intel Mini PC BKNUC9VXQNX2
Device SupportedDesktop PC
Environmentally FriendlyYes
Environmental CertificationRoHS 2
General Information
Product TypeSolid State Drive
Manufacturer Part NumberTS256GMTE662T2
Manufacturer Website Addresshttp://www.transcend-info.com
ManufacturerTranscend Information, Inc
Product ModelMTE662T2
Product NameMTE662T2 Solid State Drive
Brand NameTranscend

Transcend MTE662T2 256 GB Solid State Drive – M.2 2280 Internal – PCI Express NVMe (PCI Express NVMe 3.0 x4) – Desktop PC Device Supported – 2 DWPD – 3 Year Warranty M-KEY 3D TLC BICS4 PE 3K 8CH 30U
Transcend’s MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ” gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20_~75_. Technologies 96-layer 3D NAND Flash 30µ” PCB Gold Finger Corner Bond Extended Temperature Dynamic Thermal Throttling Thermal Sensor Read Disturbance Garbage Collection Wear Leveling TRIM Bad Block Management Early Move Firmware Features Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Global Wear-Leveling and Block management for reliability Advanced Garbage Collection Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices Full drive encryption with Advanced Encryption Standard (AES) (optional) Hardware Features Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (80mm) – ideal for mobile computing devices PCIe Gen 3 x4 interface DDR4 DRAM Cache embedded Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed Key components fortified by default with Corner Bond technology 30µ” PCB gold finger Promised operational reliability in an extended temperature range (from -20°C to 75°C) Supports Transcend Scope Pro software

Transcend TS256GMTE662T2